Flexible Electronics News

Meyer Burger to Showcase Thin Film Encapsulation Technology at LOPEC

CONx TFE system provides excellent water and oxygen barrier properties without compromising optical transparency.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Meyer Burger will exhibit its Thin Film Encapsulation (TFE) and Barrier Film technologies at LOPEC. The technology is key in the production of flexible and sensitive electronic devices. It replaces glass encapsulation in OLED lighting and display panels offering equivalent moisture and oxygen barrier functionality at reduced device thickness and weight in combination with improved flexibility and robustness. The technology also enables other flexible display products, thin film batteries and pro...

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